Sell [Shop Malaysia] LAIRD Thermal Pad Thermal Paste Laptop PC Motherboard CPU GPU Cooler Heatsink best price

USA LAIRD High Performance Thermal Pad Thermal Paste Laptop PC Motherboard CPU GPU Cooler Heatsink Tflex 300 Technical Data: Size: 80mm x 40mm x 1mm Thermal conductivity of 1.2 W/mK Extreme compliancy allows material to “totally blanket” components Low compression set enables the pad to be reused many times Tflex 700 Technical Data: Size: 70mm x 20mm x 1mm Thermal conductivity 5.0 W/mK Highly compliant Low thermal resistance even at low pressure Available in thicknesses from 0.5mm thru 5.0mm (0.020” thru 0.200”) in 0.25mm (0.010”) increments Naturally tacky for adhesion during assembly and transport Tflex HD90000 Technical Data: Size: 70mm x 20mm x 1mm Thermal conductivity 7.5 W/mK Low pressure versus deflection Excellent surface wetting for low contact resistance Minimizes board and component stress Low Outgassing Low D3-D20 (< 20ppm) Large tolerance applications